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| Name | Last modified | Size | Description |
|---|---|---|---|---|
| Parent Directory | - | ||
| Applications Note for Wafer Packaging Assembly_Rev_3.pdf | 14-Aug-2012 16:18 | 649K | |
| Applications Note for Wire Bonding_Rev_1.pdf | 14-Aug-2012 16:18 | 499K | |
| Design Appliction Note for SBC18H2_SBC13HA_Rev_9.pdf | 07-Mar-2013 22:33 | 1.1M | |
| Design Rules_Rev_5.pdf | 14-Aug-2012 16:23 | 2.2M | |
| Digital Design Manual_Rev_9.pdf | 14-Aug-2012 16:20 | 1.4M | |
| Electrical Specification_Rev_8.pdf | 14-Aug-2012 16:22 | 367K | |
| JAZZsbc13.cshr | 14-Aug-2012 15:20 | 250 | |
| Jazz Cadence AMS Design System Overview_Rev_4.pdf | 14-Aug-2012 16:19 | 1.2M | |
| Jazz Cadence Design Kit Installation Instructions_Rev_5.pdf | 14-Aug-2012 11:14 | 616K | |
| Modeling Design Manual_Rev_4.pdf | 14-Aug-2012 16:22 | 15M | |
| TapeOut User Guide_Rev_6.pdf | 14-Aug-2012 16:21 | 2.4M | |
| Tape Out User Guide_Rev_7.pdf | 14-Aug-2012 16:21 | 2.4M | |
| Wafer Content Disclosure_Rev_18.pdf | 14-Aug-2012 16:18 | 240K | |
| Wafer ECCN Classification.pdf | 14-Aug-2012 16:20 | 227K | |