demo_bondpad

1. Symbol:

2. Demo kit Bond Pad:

Parameters:

Name	Description	Unit	Default
File	Name of the attached s2p file	nil	nil
Temp	Temperature (non editable)	Degree Celsius	25

3. Notes:

a) Fixed size, hence not editable. Layout is EM simulated and 2-port S-parameter file is attached as a model.

b) Available both in schematic and layout with synchronization.

Example:

Usage of Bondpad in the Layout:

a) In general, any metal layer gets connected to the bond pad. However, only M2 layer shows connected when snapped to the edge pin. Other Metal layers get connected when they are placed anywhere else in the pad area.

b) To the center pin, Port on M2 layer should be used.